FOR THE FULL CONFERENCE PROGRAMME AND TIMETABLE PLEASE CLICK HERE: https://manuscripts.eumwa.org/frontend/index.php?page_id=327&v=TimeTable&day=39
Mehmet Kaynak (IHP GmbH), Joachim Oberhammer (KTH Royal Institute of Technology):
"Micromachining and 3D Integration for RF-to-THz Applications"
Micromachining is a technology which has enabled the ubiquitous presence of billions of micro-sensors which surround us in our daily life. In the RF and microwave world, micromachining and MEMS (micro-eletromechanical systems) has become known for the past 20 years through RF MEMS switches, which are drastically miniaturized mechanical switches with near ideal electrical properties, in particular low loss and high linearity. By now, RF MEMS switches found their way into commercial products, for instance mobile-phone antenna matching circuits. However, micromachining can do much more for the microwave world than just planar microrelays. Micromachining allows for fabricating 3-dimensional structures, which has enabled silicon-wafer integrated waveguide components and systems reaching far up into the terahertz spectrum, at losses much lower than conventional metal waveguides, and with small geometrical features not achievable by any other fabrication technique. 3D micromachining also allows for integrating RFICs with sensor interfaces, for instance microfluidic channels, resulting in highly miniaturized RF-sensing platforms. Furthermore, 3D integration has enabled the vertical stacking of circuits even in different technologies, resulting in highly versatile, compact, high-performance multi-technology RF systems. The micromachining process technologies developed for MEMS devices have also started to be used in 3D integration for adding new functions to the overall system and miniaturization purposes as well. The combination of micromachining technologies with the 3D stacking is getting crucial for highly integrated smart systems for next generation RF and mm-wave applications. This workshop comprises five selected talks presented by speakers from academia, research industries, and industries, presenting latest achievements in classical RF MEMS devices over 3D micromachined THz MEMS systems and 3D micromachined RF sensor integration, to 3D integrated RF circuit platforms.
Taijun (Liu Ningbo University, Ningbo, Zhejiang, P.R. China), Chao Yu, Ke Wu (Ecole Polytechnique, University of Montreal):
Advanced PA Architectures and Linearization Techniques
This session gathers five speakers who will discuss different aspects for advanced PA architectures and linearization techniques respectively, including broadband power amplifiers for 5G communications, broadband filtering high-efficiency Doherty amplifier based on a novel post-matching network, wide-band/multi-band Doherty and outphasing power amplifier designs, and digital predistortion (DPD) techniques for ultra-broad band 5G power amplifiers and 5G massive MIMO transmitters. Waveform-based broadband power amplifier design through a nonlinear solver, broadband/multi-band Doherty power amplifier design, digital dual-input Doherty power amplifier and all-digital CMOS power amplifier design for handsets and small-cells will be presented. A novel DPD technique will be proposed to linearize a 5G massive MIMO transmitter and the capability of a few deep neural networks for linearizing 5G power amplifiers will be discussed and illustrated with some typical experimental results.
Chi Hou Chan, (City University of Hong Kong), Ke Wu, (Ecole Polytechnique, University of Montreal)
Special Session on THz Science and Technology in East Asia
Terahertz technologies have entered a phase of unprecedented interest and expansion, offering opportunities for new engineering paradigms to fill the void between the lower frequencies of electronics and the higher frequencies of photonics. This emerging field has been recognized as of extreme importance for many scientific and engineering applications in future ultra-high data-rate wireless communications, chemical and biological spectroscopy and sensing, and inspection and quality control in manufacturing, etc., in addition to radio astronomy. This special session is organized to showcase some selected research in East Asia on THz transceiver ICs, packaging, detection and applications.
Marco Lisi (ESA). Fiammetta Diani (GSA)
European GNSS technological developments and applications.
The session will provide an overview of the most significant technological fall-outs, with special focus on radio frequency and microwaves, induced by the European GNSS, Galileo. Remarkable results have been achieved over the years, in the field of user receiver technologies and testing, through the Horizon 2020 R&D activities and dedicated user receiver developments. The session will include an overview paper by the European GNSS Agency, one paper (tbc) about the system test facilities at the European Joint Research Center, and three papers about representative developments in the field of antennas, anti-jamming capabilities and chip receiver architectures.
Petronilo Martin Iglesias (ESA):
Microwave Technology Developments for Space Applications
Satellite telecommunication systems are facing a severe competition with ground systems to provide internet services. The number of subscribers has considerably increased in the last years requiring higher satellite capacity and a cost per Mbps reduction without increasing the cost per satellite. Pressure of service providers to reduce the cost is being translated in demanding requirements to the components, not only in terms of performance but also cost and lead-time. In the case Earth Observation and Navigation systems, technology development are mainly driven my accommodation and RF performance (high power handling, efficiency, stability, etc.) This special session has the purpose to present the latest developments in the field of microwave hardware development. The papers will cover a wide range of technologies such as amplifiers, filters, frequency conversion, modelling, etc.
Marco Pasian and Giulia Matrone (Università degli Studi di Pavia):
Phantoms for Biomedical Applications at MW Frequencies
"Phantoms for biomedical applications at microwave frequencies are instrumental for the development of virtually all devices and instruments in this field, from imaging to dosimetry. The current research trends include, but are not limited to, novel materials, longer preservation times, extended frequency ranges, 3D-printing approaches, flexibly numerical models, and multi-modal scenarios."
Michal Cifra (UFE, Academy of Scieces, Czech Republic), Luciano Tarricone (University of Salento)
Planar and On-chip RF&MW Devices for Biomedical Applications
Planar and on-chip RF&MW devices enable novel applications in medicine as sensors and applicators as well as cutting edge basic research for cellular and biomolecular label-free sensing and for analysis of the effects of electromagnetic field at the cellular level via integration with advanced microscopy techniques.
Jan Kraček (Czech Technical University in Prague)
Wireless Power Transfer and Energy Harvesting: Theory and Applications
The session focuses on various principles of wireless power transfer and energy harvesting. They are emerging technologies due to the massification of portable appliances and wireless sensor networks which need to be charged and powered. Theoretical and application aspects are covered. Near and far electromagnetic field approaches using different frequency bands, power levels, and transfer ranges are included.
Session Chairs: Dr. Dmitry Lyubchenko ( Royal Institute of Technology, Sweden), and Prof.dr.ir Idelfonso Tafur Monroy, (Eindhoven University of Technology, the Netherlands)
Terahertz Technologies for Sensing, Imaging and Communications
This special session highlights European research on photonics and electronics, and co-integration of THz systems for sensing, imaging and communications. Under the co-organization by two H2020 Marie Sklodowska-Curie networks ITN CELTA and ITN TerraApps. The talks will include selected presentation on the currently developed demonstrator in the two projects and distinguished invited speakers. Topics covered are terahertz technology for imaging and sensing, demonstrator for sub-THz wireless communications, THz and optical spectroscopy, sub-systems and demonstrations of THz VNA, and co-integration of photonics and electronics for THz systems on chip.
Paul Stauffer (Thomas Jefferson University, Dept. of radiation Oncology, Philadelphia PA USA), David Vrba (Czech Technical University in Prague, Dept. of Biomedical Technique, Czech Republic)
Microwave Technologies in Medical Therapy
The session is focused on applications of microwave technologies in medical therapy. Papers on microwave hyperthermia used in cancer treatment will be presented in this session – with special respect to new technologies for implementation of various kinds of applicators for this method of cancer treatment. Special session “Microwave Technologies in Medical Therapy” is prepared in cooperation with Dr. Hans Creeze (AMC Amsterdam).
Marko Helbig (TU Illmenau), Jan Vrba jr. (Czech Technical University in Prague, Dept. of Biomedical Technique, Czech Republic)
Microwave Technologies in Medical Diagnostics
The session is focused on applications of RF and microwave electromagnetic fields in medical diagnostics. Papers on HW and SW design for microwave tomography, stroke detection and classification, phantoms of biological tissues for microwave imaging and measurement of dielectric properties of biological tissues and their phantoms will be presented in this session. Special session “Microwave Technologies in Medical Diagnostics” is prepared in cooperation with Prof. Andrea Massa (Eledia - Trento).
Opening Session, Monday, May 13
Substrate Integration Technologies towards 5G Systems
University of Pavia, Italy
The advent of the fifth generation of mobile communication (5G) and of the Internet of Things (IoT) requires a completely new approach to the development of wireless microwave systems. The next generation of microwave systems demands a technology that guarantees easy integration of complex wireless systems, combination of multiple functions in a single device, low development cost, compact size and low weight.
Among the available technologies, the substrate integration waveguide (SIW) technology looks a suitable approach for the implementation and integration of microwave components and systems for 5G and IoT applications. In fact, SIW technology allows to implement a variety of passive components, active subsystems, and antennas in a simple and cost-effective way, and to integrate entire systems in a single dielectric substrate, thus avoiding complex transitions and undesired parasitic effects.
Currently, significant effort is devoted to the design of miniaturized SIW components and systems, that preserve high performance in a reduced footprint (e.g. folded, half-mode, and quarter mode SIW). Moreover, the loss minimization has stimulated the investigation of novel solution, as the air-filled SIW. Finally, the choice of the materials represents another key point: depending on the specific application, different requirements are posed, which lead to the use of textile, paper, and 3D printed materials.
This presentation will cover the current trends of SIW technology in the new scenario of the IoT/5G, with particular emphasis on the structure miniaturization, the novel design techniques, and the selection of unconventional materials.
Precise Time Scale and Navigation Systems
Director of Time Department, Bureau International des Poids et Mesures, BIPM, Sevres Cedex, France
Highly accurate atomic clocks developed all over the world allow the international time keeping and the synchronization of different networks for telecommunication, energy distribution, financial transactions, and fundamental science. Atomic clocks are also the heart of Global Satellite Navigation Systems: measuring position means, among others, measuring time. The lecture explores the needs of precise Timing, explaining the current international timekeeping architecture and giving insights on the timing systems of the current GNSS: the most demanding applications that still challenge Time Metrology.
Plenary Session, Tuesday, May 14Design and Development of Novel Microwave Antennas for Clinical Applications in Thermal Medicine
This presentation will introduce the field of thermal medicine as a wide open arena for innovations in microwave device development. After establishing the underlying clinical needs and reviewing typically available technology, several examples of microwave devices that are representative of trends for the future will be considered.
The presentation will highlight several novel microwave antennas and antenna array systems that were designed and optimized for one specific medical application. These examples were selected as representative of countless applicator developments that address a wide range of clinical applications. Specific device solutions will be used to illuminate the design goals, construction, and performance evaluation of antennas developed for therapeutic applications such as hyperthermia therapy for cancer, and diagnostic applications such as non-invasive monitoring and control of thermal therapy, and detection of deep tissue injury or disease.
After examining some recent antenna developments that have already improved clinical medicine, the presentation will end with a short list of medical applications that still await innovative solutions. Along with a healthy appreciation for past successes in device development, it is important to contemplate the actual process of accurately translating clinical challenge to appropriate design goals, followed by adaptable device features and effective clinical performance. A good understanding of this process should enhance both the motivation for and the success in continued microwave antenna development for the field of medicine.
New Integration and Circuit Concepts Using III-V Semiconductor Components
Microelectronics today is dominated by silicon technology, also in the RF domain. However, III-V components have maintained their share because their physical properties offer advantages if it comes to high power at high frequencies or high switching speeds. The talk addresses two topics where these benefits are utilized to realize new solutions in the microwave and mm-wave frequency range. On the one hand, this is the hetero-integration of InP bipolar devices with BiCMOS. It allows to combine III-V and Si circuits on a single die, thus expanding the SoC concept. On the other hand, digital power amplifiers for the GHz range are presented which constitute a further step towards digitizing RF functions.
Closing Session, Wednesday May 15
An Introduction to Cognitive Radar With Application Examples
Alfonso Farina, Antonio De Maio, Simon Haykin, (retired)
Seles ES a Finmeccania Company
The lecture summarizes the content of the recent published book: A. Farina, A. De Maio, S. Haykin, (Editors), "The impact of Cognition on Radar Technology", Scitech Publishing, an Imprint of the IET Publisher, 2017. In particular, the lecture will describe the following topics. 1) Introduction to cognitive radar with an industrial point of view. 2) Cognitive radar inspired by the brain. 3) Cognitive radar and its application to CFAR detection and receiver adaptation. 4) Cognitive radar waveform design for spectral compatibility. 5) Cognitive optimization of the transmitter – receiver pair. 6) Cognitive control theory with an application. 7) Cognition in radar target tracking with related study cases. 8) Exploitation of cognition in MIMO radar, electronic warfare, and synthetic aperture radar. 9) Potential applications and examples for cognitive radar.
Electromagnetic Encoders for Microwave Sensors and Chipless-RFID
Ferran Martín, Cristian Herrojo, Javier Mata-Contreras, Ferran Paredes
Universitat Autònoma de Barcelona, Spain
Abstract: Electromagnetic encoders based on chains of resonant elements printed on a dielectric substrate are discussed. Such encoders constitute a low-cost alternative to optical encoders, and are of special interest for motion control applications in environments subjected to harsh conditions. It is also shown that by printing the resonant chains in low-cost plastic or paper substrates, these electromagnetic encoders are useful for near-field chipless-RFID with unprecedented number of bits, and applications such as secure paper or smart packaging can be envisaged. Strategies to enhance the density of resonant elements, a key aspect to improve system performance, are discussed.
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